Title:
半導体デバイスの製造方法及び熱伝導シート
Document Type and Number:
Japanese Patent JP7160102
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.
Inventors:
Mika Kobetsu
Tomoaki Yajima
Tomoaki Yajima
Application Number:
JP2020537975A
Publication Date:
October 25, 2022
Filing Date:
August 23, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01L23/36
Domestic Patent References:
| JP2017038086A | ||||
| JP2004288825A | ||||
| JP2016046499A |
Foreign References:
| WO2017073727A1 | ||||
| WO2018030079A1 | ||||
| WO2018123012A1 | ||||
| WO2016140020A1 | ||||
| WO2014115456A1 | ||||
| US20140374071 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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