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Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2012186235
Kind Code:
A
Abstract:

To provide a technology of fixing an optical component to a sensor chip at high accuracy.

A semiconductor device manufacturing method comprises: after mounting a sensor chip 3 provided with a surface 3a having a sensor surface on which a plurality of light receiving elements are formed, face up on a wiring board 2, arranging adhesive materials at a plurality of places on the surface 3a of the sensor chip 3 to form a plurality of adhesive spacers SP1 by curing the adhesive materials; arranging paste adhesive materials 11a on the surface 3a of the sensor chip 3; arranging an optical component 5 held by a bonding tool 23 on the surface 3a of the sensor chip 3 via the spacers SP1 and the adhesive materials 11a; and subsequently, fixing the optical component 5 by removing the bonding tool 23 from the optical component 5 and curing the adhesive materials 11a without applying a load to the optical component 5.


Inventors:
WADA EIJI
Application Number:
JP2011047064A
Publication Date:
September 27, 2012
Filing Date:
March 04, 2011
Export Citation:
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Assignee:
RENESAS ELECTRONICS CORP
International Classes:
H01L27/14; H01L21/56; H01L23/02
Domestic Patent References:
JP2009218870A2009-09-24
JP2002305261A2002-10-18
JPH0216670U1990-02-02
JP2005252183A2005-09-15
JP2002026301A2002-01-25
JP2010225904A2010-10-07
JP2010153745A2010-07-08
JP2005519471A2005-06-30
JP2009218870A2009-09-24
JP2002305261A2002-10-18
JPH0216670U1990-02-02
JP2005252183A2005-09-15
JP2002026301A2002-01-25
JP2010225904A2010-10-07
JP2010153745A2010-07-08
JP2005519471A2005-06-30
Attorney, Agent or Firm:
中原 亨
坂次 哲也
筒井 大和
筒井 章子
菅田 篤志



 
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