To inhibit chipping of a semiconductor layer associated with dicing cut.

A semiconductor device comprises a chip inhibition member which has a Young's modulus higher than that of a transparent resin layer and which is formed with respect a dicing cut part in a pre-singulation layer structure in contact with a semiconductor layer. In comparison with a cavityless structure in the past in which a transparent resin layer having a comparatively low Young's modulus contacts a semiconductor layer, chatter (vibration) of the semiconductor layer in dicing cut can be inhibited and clogging of a dicing blade can be inhibited and chipping of the semiconductor layer associated with the dicing cut can be effectively inhibited.