Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2015191939
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves a plurality of semiconductor chips to achieve temperature uniformity while achieving downsizing of the semiconductor device.SOLUTION: A semiconductor device 1 is a device where a semiconductor chip 6 and the like are housed in a semiconductor package 2. The semiconductor package 2 is composed of a metal base 12, a metallic or ceramic wall part 10, a ceramic terminal 11, and an external lead terminal 5. An outer shape of the semiconductor package 2 has a width W and a length L. The metal base 12 has a surface 12a and a plurality of semiconductor chips 6 are provided on the surface 12a. Each of the semiconductor chips 6 has long sides 6a and short sides 6b. The plurality of semiconductor chips 6 are arranged to face the long sides 6a each another. The plurality of semiconductor chips 6 are obliquely provided so as to make the neighboring semiconductor chips 6 incline to the same side in plan view of the surface 12a.
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Inventors:
MIYAWAKI KATSUMI
Application Number:
JP2014066382A
Publication Date:
November 02, 2015
Filing Date:
March 27, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/04; H01L21/338; H01L23/02; H01L25/18; H01L29/812
Domestic Patent References:
| JP2000174199A | 2000-06-23 | |||
| JP2003234442A | 2003-08-22 | |||
| JP2002343909A | 2002-11-29 | |||
| JP2013153097A | 2013-08-08 | |||
| JPH02146842U | 1990-12-13 | |||
| JP2008311467A | 2008-12-25 | |||
| JPS57207356A | 1982-12-20 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno