SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Title:

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2017059659

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can reduce adhesion of particles to a surface of a substrate.SOLUTION: A semiconductor device manufacturing method of the present embodiment comprises: a process of carrying in a substrate where a magnetic material film is formed in a processing container; a process of adjusting a pressure in the processing container to a first pressure lower than an atmospheric pressure; a process of adjusting the pressure in the processing container at the first pressure to a second pressure higher than the first pressure; and a process of applying a magnetic field to the magnetic material film at the second pressure to magnetize the magnetic material film.SELECTED DRAWING: Figure 3

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Inventors:

YAMAZAKI MITSURU
YAMASHITA KOJI

Application Number:

JP2015182659A

Publication Date:

March 23, 2017

Filing Date:

September 16, 2015

Export Citation:

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