Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7135864
Kind Code:
B2
Abstract:
A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.
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Inventors:
Aya Kasahara
Toshio Nonaka
Daisuke Fujimoto
Naoya Suzuki
Toshio Nonaka
Daisuke Fujimoto
Naoya Suzuki
Application Number:
JP2018555044A
Publication Date:
September 13, 2022
Filing Date:
December 06, 2017
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01L23/29; H01L21/56; H01L23/12; H01L23/31
Domestic Patent References:
| JP2007201387A | ||||
| JP2014197569A | ||||
| JP7007134A | ||||
| JP2016092106A | ||||
| JP2011032434A | ||||
| JP2009054666A |
Foreign References:
| US20110233754 | ||||
| US6154366 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano