Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM
Document Type and Number:
Japanese Patent JPH0513533
Kind Code:
A
Abstract:

PURPOSE: To reduce residue dam resin at the time of tie bar cutting by eliminating relative positional deviation between a lead frame and a resin package generated when a resin is sealed in.

CONSTITUTION: The system comprises a camera 6 for picking up the image of the IC package 4 just before an IC package 4 is worked by an IC working part 1, an identifying part 7 which processes the picked up image and calculates positional deviation amount, a control part 8 which corrects the deviation amount of feeding position of a lead frame 3 when the IC package 4 is supplied to the IC working part 1, a lead frame carrying part 5 which contains a servo motor that supplies the IC package 4 to the IC working part 1 by a corrected feeding amount.


Inventors:
IKEDA FUMIMARO
Application Number:
JP16482991A
Publication Date:
January 22, 1993
Filing Date:
July 05, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L21/66; H01L23/50; (IPC1-7): H01L21/66; H01L23/50
Attorney, Agent or Firm:
Uchihara Shin