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Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING THEREOF AND APPLIED SYSTEM USING THE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0714992
Kind Code:
A
Abstract:

PURPOSE: To prevent an interfacial layer with low permittivity at an interface between an insulating film and an electrode, by using a capacitive-element electrode made of metal, of which an oxide film is made of an insulating substance with permittivity larger than a given value.

CONSTITUTION: In a capacitive element, a lower electrode 2 made of 100nm tantalum(Ta), a first insulating layer 3 made of 5nm tantalum pentoxide (Ta2O5) with permittivity of 25, a second insulating layer 4 made of 25nm tantalum dioxide (TiO2) with permittivity of 100, and an upper electrode 5 made of 100nm titanium nitride (TiN) are formed on a silicon substrate 1. In this TiO2/Ta2O5/Ta laminate structure, an insulating-film layer with low permittivity is not produced at an interface between an electrode and a dielectric substance, and a capacitive element with large capacity can be realized. The electrode in the capacitive element is preferably made of metal with a smaller absolute value of oxide generative free energy than that of the metal that constitutes the oxide insulating substance.


Inventors:
ABE YOSHIO
FUKUDA TAKUYA
Application Number:
JP14326993A
Publication Date:
January 17, 1995
Filing Date:
June 15, 1993
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L27/04; H01L21/822; H01L27/108; (IPC1-7): H01L27/108; H01L21/822; H01L27/04
Attorney, Agent or Firm:
Ogawa Katsuo