To provide a multilayer printed board using a chip type high frequency line which facilitates the matching of its impedance and efficiently uses a wiring layer of the printed board.

A high frequency line on a multilayer printed board 100 is laid on a surface layer of the printed board or an inner wiring layer and wired, using a chip strip line 102. A plurality of chip type strip lines 102 having a plurality of characteristic impedances are prepared and one strip line having a desired impedance is selected among them, thus facilitating the impedance matching. An inner layer strip line occupying a plurality of wiring layers is disposed on the inner wiring layer of the multilayer printed board and moved to the chip type strip line 102, thereby efficiently using the inner wiring layer.