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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2001133213
Kind Code:
A
Abstract:

To provide a fingerprint sensor of a structure not destroying a switching element or the like even when static electricity is discharged between a finger and a sensing pad electrode.

This device is provided with the switching element Tr formed on a semiconductor substrate (or a semiconductor layer supported by a substrate) 2, and the sensing pad electrode SP connected to one impurity area 6b of it for inducing electric charges for an amount corresponding to a capacitance value between a detection object (finger) and the electrode or supplying them through the switching element Tr. A protective means connected to the sensing pad electrode SP for releasing excessive electric charges impressed or stored on the sensing pad electrode SP, a protective diode Di for instance, is formed on the semiconductor substrate 2.


Inventors:
KOSHIO KENJI
Application Number:
JP31722899A
Publication Date:
May 18, 2001
Filing Date:
November 08, 1999
Export Citation:
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Assignee:
SONY CORP
International Classes:
G01B7/28; G01B7/34; G06K9/00; G06T1/00; H01L21/822; H01L27/04; A61B5/117; (IPC1-7): G01B7/34; A61B5/117; G01B7/28; G06T1/00; H01L27/04; H01L21/822
Attorney, Agent or Firm:
Takahisa Sato