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Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2005039242
Kind Code:
A
Abstract:

To enable a metal plate to be exposed without a sealant removing operation.

A semiconductor device comprises: a plurality of semiconductor devices 9-12, one side of which is bonded and electrically connected to a wiring substrate 1; a plurality of metal plates 5-8, one end side of which is bonded to the other side of the plurality of semiconductor devices 9-12, with the other end side of which being bonded and electrically connected to the wiring substrate 1; a thermoplastic resin 3 for sealing to integrate the metal plates 5-8 in such a way to expose the side opposite to the side of the metal plates 5-8 which is bonded to the semiconductor devices 9-12; and a thermosetting resin 2 for sealing the periphery of the thermoplastic resin 3 and the semiconductor devices 9-12.


Inventors:
TOMIOKA TAIZO
SHIMOKAWA KAZUO
Application Number:
JP2004186041A
Publication Date:
February 10, 2005
Filing Date:
June 24, 2004
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L23/34; H01L21/56; H01L23/31; H01L23/36; H01L23/492; H01L23/498; H01L25/04; H01L25/065; H01L25/07; H01L25/18; (IPC1-7): H01L25/04; H01L21/56; H01L23/34; H01L25/18
Domestic Patent References:
JPH1032305A1998-02-03
JP2002110893A2002-04-12
JP2003007928A2003-01-10
JPH1167800A1999-03-09
JP2001274177A2001-10-05
JP2002151633A2002-05-24
JP2001308263A2001-11-02
JP2000223512A2000-08-11
JP2002026067A2002-01-25
JP2002076245A2002-03-15
JPH01293591A1989-11-27
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto



 
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