Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2005129904
Kind Code:
A
Abstract:
To improve heat dissipation and high-frequency properties of a semiconductor device.
A semiconductor device 100 comprises a first conductive film 102 and a second conductive film 104 which are provided on both sides of an insulating resin film 106. A circuit element 120 is placed on the second conductive film 104. The circuit element 120 is electrically connected to the second conductive film 104. The second conductive film 104 is provided to cover a via plug 110. The via plug 110 is formed such that its diameter tapers from the first conductive film 102 toward the second conductive film 104.
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Inventors:
IMAOKA SHUNICHI
USUI RYOSUKE
NAKANO ATSUSHI
KATO ATSUSHI
USUI RYOSUKE
NAKANO ATSUSHI
KATO ATSUSHI
Application Number:
JP2004264134A
Publication Date:
May 19, 2005
Filing Date:
September 10, 2004
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
H01L23/498; H01L23/12; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2003224356A | 2003-08-08 | |||
| JP2000077568A | 2000-03-14 | |||
| JP2001308548A | 2001-11-02 | |||
| JP2000504495A | 2000-04-11 | |||
| JPH08264581A | 1996-10-11 |
Attorney, Agent or Firm:
Sakaki Morishita
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