SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Title:

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2005191237

Kind Code:

A

Abstract:

To solve the problems that, since a fuse pad and an external connection pad are provided on the same wiring layer, each pad and a wiring are densely arranged, an area of the wiring layer is increased, the number of semiconductor chips taken from one wafer is decreased, and a semiconductor chip cost is raised.

This semiconductor device comprises a first wiring layer having the external connection pad for connecting with at least an external leading terminal, a current melting type fuse provided in an optional wiring layer for changing characteristics of the semiconductor device, and a second wiring layer which is connected to the current melting type fuse, and differs from the first wiring layer having the fuse pad for abutting a terminal to which the cutting current of the current melting type fuse is applied.

Inventors:

KAYAZONO HIRONOBU

Application Number:

JP2003430007A

Publication Date:

July 14, 2005

Filing Date:

December 25, 2003

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

H01L21/3205; H01L21/82; H01L21/822; H01L27/04; (IPC1-7): H01L21/822; H01L21/3205; H01L21/82; H01L27/04

Attorney, Agent or Firm:

Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa

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