To provide a compact semiconductor device with an insulation board positioned on a top plate of a cooler without increasing the number of processes or manufacturing cost, and to provide a method of manufacturing the same.
In this semiconductor device 1, a semiconductor element 4 is arranged above a cooler 2 through an insulation board 3. The cooler 2 includes a case 13 including a top plate 12, and a cooling fin 14 housed in the case 13 and having a plurality of fin parts 14a directed toward the top plate 12. The insulation board 3 is joined onto the top plate 12. Partial fin parts 14a, out of the plurality of fin parts 14a of the cooling fin 14, matching the arrangement of the insulation board 3 on the top plate 12 have length smaller than that of the fin parts 14a in the other parts, and thereby a recessed part 16 is formed on the upper side of the cooling fin 14. When joining the insulation board 3 onto the top plate 12, the top plate 12 is made to sink in accordance with the recessed part 16 of the cooling fin 14 by softening the top plate 12 while being pressed through the insulation plate 3, and the insulation plate 3 is fitted into the sinking part 17 generated on the top plate 12, whereby the insulation board 3 is positioned on the top plate 12.
TAKETSUNA YASUHARU
KAKIUCHI EISAKU
TAKEBE KATSUHIKO
TAKENAGA TOMOHIRO
