To provide a semiconductor device capable of reducing the size and thickness thereof and enhancing the function thereof, to provide a method of manufacturing the same, to provide an electronic component, to provide a circuit board, and to provide an electronic apparatus.

This semiconductor device includes: a semiconductor substrate 10; external connection terminals 37 arranged on a first surface 10a of the semiconductor substrate 10; a first electrode 22 formed on the first surface 10a of the semiconductor substrate 10 and electrically connected with the external connection terminal 37; a second electrode 23 electrically connected with an electronic element mounted on a second surface 10b facing the first surface 10a of the semiconductor substrate 10; a groove 11 formed on the second surface 10b of the semiconductor substrate 10 and reaching the second electrode 23; and a conductive portion 12 formed inside the groove 11 and electrically connected with the rear surface 23a of the second electrode 23.