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Title:
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND LIGHTING APPARATUS
Document Type and Number:
Japanese Patent JP2015149509
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving a reflectance of light at a side surface of the semiconductor device and enhancing an extraction efficiency of light in a lighting apparatus, a method for manufacturing the same and the lighting apparatus.SOLUTION: The semiconductor device 20 comprises a die pad 25; a lead frame 10 having coupling parts 27 coupled to the die pad 25; an LED element 21 placed on the die pad 25 of the lead frame 10; and an outer resin part 23 covering the lead frame 10. The lead frame 10 consists of Cu or Cu alloy, and each of coupling parts 27 are exposed outward from side surfaces 23bto 23bof the outer resin part 23. Sectional thicknesses of the coupling parts 27 at side surfaces 23bto 23bof the outer resin part 23 are thinner than those of other portions of the lead frame 10.

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Inventors:
ODA KAZUNORI
KAWAI KENZABURO
MURATA YOSHINORI
SUZUKI KOICHI
Application Number:
JP2015096592A
Publication Date:
August 20, 2015
Filing Date:
May 11, 2015
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L33/62; F21S2/00
Domestic Patent References:
JP2010182770A2010-08-19
JP3130684B22001-01-31
JP3108452B22000-11-13
JP2012142426A2012-07-26
JP2005353914A2005-12-22
JP2009283883A2009-12-03
JP2010062272A2010-03-18
JP2006344925A2006-12-21
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Yukihiro Hotta
Takuhisa Murata



 
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