Title:
Semiconductor device and method of manufacturing the same
Document Type and Number:
Japanese Patent JP6056490
Kind Code:
B2
Abstract:
A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.
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Inventors:
Takeshi Imamura
Atsuwa Shimizu
Yasunori Fujimoto
Atsuwa Shimizu
Yasunori Fujimoto
Application Number:
JP2013004465A
Publication Date:
January 11, 2017
Filing Date:
January 15, 2013
Export Citation:
Assignee:
Socionext Inc.
International Classes:
H01L23/40; H01L23/34
Domestic Patent References:
| JP2001358452A | ||||
| JP2011035352A | ||||
| JP2001127218A | ||||
| JP7321257A | ||||
| JP10004157A | ||||
| JP2011023587A | ||||
| JP2007258430A |
Foreign References:
| WO2009084301A1 |
Attorney, Agent or Firm:
Keizo Okamoto
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