Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7241923
Kind Code:
B2
Abstract:
It is an object to provide technology enabling suppression of contact deformation of pin fins during assembly of a semiconductor device and the like. A semiconductor device includes a base plate, a semiconductor element, and a resin member. The base plate has a plurality of pin fins on a lower surface thereof. The semiconductor element is mounted on an upper side of the base plate. The resin member covers at least a side surface of the semiconductor element. The resin member has a rib covering a side surface of the base plate, and a lower end of the rib is located below lower ends of the plurality of pin fins.
Inventors:
Kimoto Nobuyoshi
Application Number:
JP2021569645A
Publication Date:
March 17, 2023
Filing Date:
January 08, 2020
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/29
Domestic Patent References:
| JP2018063999A | ||||
| JP2013012663A | ||||
| JP9260550A | ||||
| JP2012164763A |
Foreign References:
| WO2017119226A1 | ||||
| WO2017033295A1 | ||||
| WO2017175612A1 | ||||
| WO2014020807A1 |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita