To obtain a semiconductor device and a semiconductor module which do not short-circuit between mounting solder bumps even if an IC package with external electrodes with narrow pitch exposed in the rear of a package body is mounted and constituted, are excellent in thermal fatigue breakdown life and have thin and small mounting area.

An IC package 17 is mounted by jointing an external electrode 19 exposed in an area of a package body 18 to a mounting land 13 provided to upper and lower surfaces of a substrate 11, an external connection land 14 connected to the mounting land 13 is provided to the outside of the IC package 17 to be mounted, solder bumps 16 for external connection are jointed to one side thereof, and a semiconductor device 34 for a semiconductor module is constituted.