Title:
半導体デバイスのモニタリング方法およびモニタリング装置
Document Type and Number:
Japanese Patent JP4778778
Kind Code:
B2
Abstract:
In an exposure process or etching process, an image feature amount useful for estimating a cross-sectional shape of a target evaluation pattern, process conditions for the pattern, or device characteristics of the pattern is calculated from an SEM image. The image feature amount is compared with learning data that correlates data preliminarily stored in a database, which data includes cross-sectional shapes of patterns, process conditions for the patterns, or device characteristics of the patterns, to the image feature amount calculated from the SEM image. Thereby, the cross-sectional shape of the target evaluation pattern, the process conditions of the pattern, or the device characteristics of the pattern are nondestructively calculated.
Inventors:
Wataru Nagatomo
Hidetoshi Morokuma
Atsushi Miyamoto
Hideaki Sasazawa
Hidetoshi Morokuma
Atsushi Miyamoto
Hideaki Sasazawa
Application Number:
JP2005320319A
Publication Date:
September 21, 2011
Filing Date:
November 04, 2005
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/66; G01B15/04
Domestic Patent References:
| JP2005069953A | ||||
| JP2003173948A | ||||
| JP2004247394A | ||||
| JP2002075815A | ||||
| JP2005286095A | ||||
| JP2005064023A | ||||
| JP9237812A | ||||
| JP2004158478A |
Attorney, Agent or Firm:
Manabu Inoue