Title:
SEMICONDUCTOR DEVICE PACKAGE FOR POWER
Document Type and Number:
Japanese Patent JP2005302951
Kind Code:
A
Abstract:
To provide a semiconductor device package for power in which a power MOSFET whose on-resistance is low and whose output capacity and rated currents are large is stored by preventing the increase of a package size.
This semiconductor package for power is provided with a plurality of semiconductor chips for power laminated with their faces having the same structures arranged so as to be electrically faced to one another, and connected in parallel and integrally sealed into sealing resin.
Inventors:
SAITO WATARU
OMURA ICHIRO
OMURA ICHIRO
Application Number:
JP2004115728A
Publication Date:
October 27, 2005
Filing Date:
April 09, 2004
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L25/07; H01L23/02; H01L23/495; H01L25/18; (IPC1-7): H01L25/07; H01L25/18
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi
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