To provide a semiconductor device plant comprising a clean room having a floor surface effectively utilized, capable of flexibly coping with a change in the arrangement of semiconductor devices, and enabling a space with uniform temperature distribution to be formed with less power consumption.
Hot air in the clean room 2 is led from an opening part 17 formed in a first ceiling 4 into the space held by the first ceiling 4 and a second ceiling 14. Then, the hot air is led into the space at the rear of the ceilings through a cooling mechanism 10. In this case, the hot air is purified and cooled to a proper temperature. After that, the air purified and cooled to a proper temperature is blown into the clean room by a fan filter unit 5 installed in the first ceiling 4 and the second ceiling 14.
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai