Title:
SEMICONDUCTOR DEVICE AND PROBE UNIT
Document Type and Number:
Japanese Patent JP3132465
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely fix a probe unit to a package semiconductor device.
SOLUTION: A groove is provided to the four corners of the rear surface of an IC package 1 mounted on a board 3. A probe unit 2 is equipped with pawls 24, which are each possessed of a pawl part 24a that is formed at the tip(lower end of a probe unit 2) of the pawl 24 towards a square cylinder, corresponding to the four sides of a hollow square cylindrical probe unit main body 29. The pawls 24 are formed of a flexible material, and when the probe unit 2 is mounted on the IC package, the pawls 24 each provided to the four corners of the probe unit 2 are pulled outwards, until the ends of the pawl parts 24a are located outside of an IC package main body 10. The IC package main body 10 is covered with the probe unit main body 29, and the probe unit main body 29 is pulled down to the bottom, and the pawls 24 are returned to the original positions.
Inventors:
Kenichi Aino
Application Number:
JP10735498A
Publication Date:
February 05, 2001
Filing Date:
April 17, 1998
Export Citation:
Assignee:
NEC
International Classes:
G01R1/073; H01L21/66; H01L23/04; G01R31/26; (IPC1-7): H01L23/04; G01R1/073; G01R31/26; H01L21/66
Domestic Patent References:
| JP5196692A | ||||
| JP5775755U |
Attorney, Agent or Firm:
Furuzo Satoshi (1 person outside)
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