Title:
SEMICONDUCTOR DEVICE AND SENSOR MODULE
Document Type and Number:
Japanese Patent JP2023118052
Kind Code:
A
Abstract:
To provide a semiconductor device in which a pressure sensor and an acceleration sensor are packaged with common sealing resin.SOLUTION: A semiconductor device includes a sensor structure including a cavity internally, a gas conduct tube that extends from an end surface of the sensor structure to the cavity and guides gas into the cavity from the outside of the sensor structure, a pressure sensor that is formed inside the sensor structure and can vibrate by an operation of the pressure of the gas guided to the cavity through the gas conduct tube, an acceleration sensor that is formed inside the sensor structure and detects the acceleration operating on the sensor structure, and sealing resin that covers the sensor structure. The gas conduct tube includes an internal end part on the side of the cavity and an external end part on the side of the end surface of the sensor structure. The external end part of the gas conduct tube is open at an end surface of the sealing resin.SELECTED DRAWING: Figure 3
Inventors:
MARTIN WILFRIED HELLER
FUJITA YUSHIN
FUJITA YUSHIN
Application Number:
JP2022166929A
Publication Date:
August 24, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
G01L9/00; G01L17/00; G01P15/08
Attorney, Agent or Firm:
Patent Attorney Corporation Ai Patent Office
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