Title:
SEMICONDUCTOR DEVICE AND SHEET-SHAPED SEALING MATERIAL USED FOR THE SAME
Document Type and Number:
Japanese Patent JP3947296
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device having superior reliability, while improving the effect for relaxing stresses on a semiconductor element, a wiring circuit board and an electrode for connection.
SOLUTION: For this device, a semiconductor element 4 is loaded through multiple electrode parts 2 and 3 for connection onto a wiring circuit board 1, and a void between the wiring circuit board 1 and the semiconductor element 4 is sealed by a sealing resin layer 5. Furthermore, the sealing resin layer 5 is equipped with an extension elasticity modulus of 300 to 150000 MPa at 25°C as well as the setting substance characteristics.
Inventors:
Masanori Mizutani
Tatsushi Ito
Makoto Kuwamura
Koji Noro
Tatsushi Ito
Makoto Kuwamura
Koji Noro
Application Number:
JP5861898A
Publication Date:
July 18, 2007
Filing Date:
March 10, 1998
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08L9/02; H01L21/60; C08G59/42; C08G59/62; C08L63/00; (IPC1-7): H01L21/60; C08G59/42; C08G59/62; C08L9/02; C08L63/00
Domestic Patent References:
| JP8008301A | ||||
| JP8165331A | ||||
| JP9246423A | ||||
| JP2083963A |
Foreign References:
| WO1996042107A1 |
Attorney, Agent or Firm:
Masahiko Nishito
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