Title:
SEMICONDUCTOR DEVICE STORING PACKAGE
Document Type and Number:
Japanese Patent JP3716173
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor package superior in transmission efficiency of high-frequency signals.
SOLUTION: The semiconductor device storing package is provided with a base board 1 having a mounting part 1a for mounting a semiconductor device 5 and a circuit board 6 on the upper face, a frame body 2 jointed to surround the mounting part 1a on the outer peripheral part of the upper face of the base board 1 and providing the fitting part of a coaxial connector 3 comprising a through hole 2a on the side part, and the coaxial connector 3 comprising a cylindrical outer peripheral conductor 3a, a central conductor 3b installed on the central axis and an insulator 3c interposed therebetween and fitted to a fitting part. A circuit board 6 forms a line conductor 6a electrically connecting the semiconductor device 5 and the central conductor 3b on an upper side main face, and a line conductor 6a makes one end connected to the central conductor 3b the narrow part of 0.7-0.9 times the width of the central conductor 3b, and the other part has substantially the same width as the central conductor 3b.
Inventors:
Toshihiko Kitamura
Application Number:
JP2000360132A
Publication Date:
November 16, 2005
Filing Date:
November 27, 2000
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/02; H01P5/08; (IPC1-7): H01L23/02; H01L23/12; H01P5/08
Domestic Patent References:
| JP10327004A | ||||
| JP10004154A | ||||
| JP9312507A | ||||
| JP9064219A |
Previous Patent: METHOD AND DEVICE FOR CONTROLLING TEMPERATURE OF FILE BAY
Next Patent: TANDEM TYPE OFFSET COLOR PRINTING METHOD
Next Patent: TANDEM TYPE OFFSET COLOR PRINTING METHOD