PURPOSE: To perform a conduction test without requiring direct contact with a probe pin by inserting an electrode connected to a semiconductor test system in a conductor to create conduction between a semiconductor device and a semiconductor test system.

CONSTITUTION: A fluid or gel conductor 4 is positioned on top of an electrode 2 of a semiconductor device using surface tension and viscosity. After that, a probe pin 3 is inserted, a connection is made with the circuit in the semiconductor device 1, and a semiconductor test is performed. When the test is finished, the conductor 4 is removed, or after wiring, hardening is achieved by heating. By inserting the electrode 2 of a semiconductor test device 1 and a probe pin 3 in a liquid or gel conductor 4 in this way, the contact surface area increases, the current capacity rises, and since the conductor changes shape in accordance with the shape of the electrode, restrictions on the electrode 2 of the semiconductor device 1 and the edge diameter, shape, material, and hardness of the probe pin 3 can be relieved.