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Title:
SEMICONDUCTOR DEVICE TESTING CONTACT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002231399
Kind Code:
A
Abstract:

To provide a contactor capable of putting all contact electrodes in contact with terminals at a proper contact pressure, and to provide its manufacturing method.

The contactor has a plurality of contact electrodes 6 arranged in a prescribed array. Each of the contact electrodes 6 has a contact portion 6c for electrically connecting a contact electrode member 6a for making contact with an electrode 2a of a semiconductor device 2 and a contact electrode member 6b for contacting the terminal of a test board. The contaact electrode 6 is supported in an array form by connecting the connection portion 6c with an insulating contact board 8.


Inventors:
MARUYAMA SHIGEYUKI
TASHIRO KAZUHIRO
WATANABE NAOYUKI
KOIZUMI DAISUKE
HATAYA TAKAFUMI
YANO EI
Application Number:
JP2001027399A
Publication Date:
August 16, 2002
Filing Date:
February 02, 2001
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
G01R1/067; G01R1/073; H01L21/66; H01R33/76; G01R31/26; (IPC1-7): H01R33/76; G01R1/067; G01R1/073; G01R31/26; H01L21/66
Domestic Patent References:
JPH10255940A1998-09-25
JPH05121135A1993-05-18
JPH09184852A1997-07-15
JPH11176548A1999-07-02
JPH11345919A1999-12-14
JP2000124397A2000-04-28
JP2000241498A2000-09-08
Attorney, Agent or Firm:
Tadahiko Ito



 
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