Title:
半導体デバイス検査方法及び半導体デバイス検査装置
Document Type and Number:
Japanese Patent JP7401543
Kind Code:
B2
Abstract:
A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.
Inventors:
Hirotoshi Terada
Yoshitake Iwaki
Yoshitake Iwaki
Application Number:
JP2021530511A
Publication Date:
December 19, 2023
Filing Date:
May 19, 2020
Export Citation:
Assignee:
Hamamatsu Photonics K.K.
International Classes:
G01R31/308; G01R31/26; G01R31/28; H01L21/66
Domestic Patent References:
| JP201362281A | ||||
| JP201383537A | ||||
| JP5152408A | ||||
| JP10150086A |
Foreign References:
| WO2004053780A1 | ||||
| WO2007144970A1 | ||||
| WO2013187200A1 | ||||
| US20050024057 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Yasushi Naito
Yoshiki Kuroki
Kenichi Shibayama
Yasushi Naito
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