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Title:
SEMICONDUCTOR DEVICE TESTING DEVICE
Document Type and Number:
Japanese Patent JP2002098736
Kind Code:
A
Abstract:

To provide a semiconductor device testing device capable of measuring electric characteristics of a semiconductor device having many electrodes and operated in a high frequency.

This semiconductor device testing device is constituted by a measuring head part 120 having a contact sheet 105 having a bump 107 in contact with a power source electrode of the semiconductor device 100 and a ground electrode on a sheet comprising a thin insulator and a first through- hole 113 formed on the position facing to a signal electrode, an elastomer 109 having a second through-hole 109a, and a base plate 110 having a third through- hole 111, for fixing the contact sheet 105 and the elastomer 109 so that the positions of the first to third through holes agree with one another, by a power source part 140 for supplying a power source to the semiconductor device 100 through the contact sheet 105, and by a probe part 130 in contact with the signal electrode from the through-hole.


Inventors:
TAURA TORU
INOUE HIROBUMI
TANIOKA MICHINAGA
KIMURA TAKAHIRO
MATSUNAGA KOJI
Application Number:
JP2000292861A
Publication Date:
April 05, 2002
Filing Date:
September 26, 2000
Export Citation:
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Assignee:
NEC CORP
International Classes:
G01R1/06; G01R31/28; H01L21/66; G01R31/26; G01R1/067; (IPC1-7): G01R31/26; G01R1/06; G01R31/28; H01L21/66
Attorney, Agent or Firm:
Nobuo Takahashi (3 outside)