To provide a high reliable BGA(Ball Grid Array) package type semiconductor device having solder balls with the same height.

The semiconductor device comprises a tape carrier 1 carrying a semiconductor chip 2, an insulation film 1b, and a lead conductor 1c electrically connected to the semiconductor chip 2, a solder ball 4 arranged on the tape carrier 1 and electrically connected to the lead conductor 1c, a lid body 10 with its dent 10a bottom fixed to the backside of semiconductor chip 2 through the first adhesive 15 and with its flat section 10b fixed to an insulation film 1b face opposite side of the solder ball 4 through the second adhesive 16, and the second adhesive 16 is devided plurally and separated each other in the manner that gaps may be made among the insulation film 1b, the lid 10, and the flat section 10b.