To solve the problem that it is difficult to provide a compact and reliable semiconductor device that can improve packaging density and can inhibit steep rise in costs.

A wafer substrate 11 is manufactured by the same process as the manufacturing process of a semiconductor. On the surface of the wafer substrate 11, pads 12a, 12b, and 15, and a semiconductor chip 13 are provided. In the semiconductor chip 13, a plurality of bumps 14 are provided, and are connected to the pad 15.