Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005243693
Kind Code:
A
Abstract:
To provide a semiconductor device having a heatsink structure in which heat radiation from a semiconductor chip is facilitated and mechanical strength in a package is raised.
A worked protrusion 22 is formed in a heatsink 21 and made to contact with a tape substrate 13. Thus, the mechanical strength is raised, and the heat radiation from the semiconductor chip 11 can be facilitated.
Inventors:
TAKENOUCHI YOSHIO
Application Number:
JP2004048000A
Publication Date:
September 08, 2005
Filing Date:
February 24, 2004
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/12; H01L23/34; (IPC1-7): H01L23/12; H01L23/34
Attorney, Agent or Firm:
Hiroshi Horiguchi