SEMICONDUCTOR DEVICE - MITSUBISHI ELECTRIC CORP

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2005348517

Kind Code:

A

Abstract:

To obtain a semiconductor device which is equipped with a temperature sensor signal output reading circuit that can improve the reliability and besides can materialize the cost reduction.

This semiconductor device is equipped with a semiconductor switching element 1 which constitutes a three-phase bridge type inverter, a temperature sensor 2 which detects the temperature of the semiconductor switching element 1 and sends it out as output voltage, a voltage current converting means which sends out a current geared to the output voltage Vf of the temperature sensor 2, a resistor 8 which converts the current sent out of the above voltage current converting means into the voltage geared to the current value, and a microcomputer 10 which reads the voltage converted by the resistor 8 via an operational amplifier 6.

Inventors:

FUKU MASARU
NAGAI HISAHIRO
KOJIMA KAZUAKI

Application Number:

JP2004165167A

Publication Date:

December 15, 2005

Filing Date:

June 03, 2004

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L27/04; H01L21/822; H01L35/00; H01L35/28; H01L37/00; H02M1/00; H02M7/48; (IPC1-7): H02M7/48; H01L21/822; H01L27/04; H01L35/00; H01L35/28; H01L37/00; H02M1/00

Domestic Patent References:

JP2001085629A	2001-03-30
JPH10123184A	1998-05-15
JP2000324893A	2000-11-24

Attorney, Agent or Firm:

Takenaka Ikuo
Masuo Oiwa
Toshihide Kodama
Keigo Murakami

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