SEMICONDUCTOR DEVICE - SUMITOMO ELECTRIC INDUSTRIES

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2007329164

Kind Code:

A

Abstract:

To provide a semiconductor device capable of prolonging a high load status of a semiconductor element.

The semiconductor device A includes semiconductor chips 11 each having the semiconductor element formed thereon, heat radiating substrate 21, wiring boards 23, dummy rings 20 provided on the side of the semiconductor chip 11 on the wiring board 23, a sealing member 15 for sealing the semiconductor chips 11, the dummy rings 20 and the like, and a heat sink member 22. When the semiconductor element in each of the semiconductor chips 11 becomes a high load state and a junction temperature rises, heat generated in the semiconductor chip 11 is absorbed by the dummy ring 20 and the temperature of the dummy ring 20 rises. Thus, a time required when the temperature of the semiconductor chip 11 reaches the upper limit is prolonged.

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Inventors:

MAEDA TAKAO

Application Number:

JP2006157182A

Publication Date:

December 20, 2007

Filing Date:

June 06, 2006

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES

International Classes:

H01L23/12

Attorney, Agent or Firm:

Kawashima Masaaki
Seiichi Watanabe

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