SEMICONDUCTOR DEVICE - MATSUSHITA ELECTRIC IND CO LTD

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2007335483

Kind Code:

A

Abstract:

To prevent dropping of yield due to peeling of metal wiring during dicing, and to prolong the service life of a dicing saw.

A scribe line area 10 is diced along a dicing area 50 by a dicing blade, an element formation area 11 is divided to semiconductor devices, and then the TEG 30 and a pad 20 in the scribe line area 10 are thoroughly removed. At that time, metal wiring 22-1 is wired at two kinds of line thickness, so that an adhesion area to a base becomes larger and peeling or turning up of the metal wiring during dicing can be prevented so as to improve manufacturing yield. In addition, it is unnecessary to retain the metal wiring 22-1 of the TEG 30 in the scribe line area 10 by a protection film 40, and a distance between the protection film 40 and the dicing saw is made large enough, thereby preventing shortening of the service life of the dicing saw due to the adhesion of the protection film 40.

Inventors:

MIYASHITA MASAYASU
KAMISAKA WATARU

Application Number:

JP2006162979A

Publication Date:

December 27, 2007

Filing Date:

June 13, 2006

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H01L21/3205; H01L21/66; H01L21/822; H01L23/52; H01L27/04

Attorney, Agent or Firm:

Mitsutake Murayama

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