Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008124296
Kind Code:
A
Abstract:
To provide a semiconductor device made of a chip which exhibits wafer reinforcement effects during a manufacturing process, is excellent in handleability, exhibits stable mounting characteristics during a mounting process, and exhibits high reliability with excellent heat dissipation of an element during actual use.
The semiconductor device is characterized by that a polybenzoazole film with a thickness of 1.5-125 m laminated via an adhesive layer with a thickness of 1-40 m on at least one of surfaces of a semiconductor wafer having a functional element formed on at least one of its surfaces.
Inventors:
MAEDA SATOSHI
OKUYAMA TETSUO
TSUCHIYA TOSHIYUKI
OKUYAMA TETSUO
TSUCHIYA TOSHIYUKI
Application Number:
JP2006307620A
Publication Date:
May 29, 2008
Filing Date:
November 14, 2006
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
H01L21/02; B81B7/02; C09J177/10; C09J179/08; H01L21/52
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