To effectively dissipate heat generated by a semiconductor chip when a semiconductor device is in operation, and to suppress variance in heat dissipation in a device and variance in dissipation between devices.
The semiconductor device includes: a wiring board 31 provided with an external connection terminal 9 on a lower surface; a semiconductor chip 1 mounted on an upper surface of the wiring board 31; a cap-shaped heat dissipation member 11 installed on the upper surface of the wiring board 31 to cover the semiconductor chip 1; a fixing pin 21 for fixing the heat dissipation member 11 on the upper surface of the wiring board 31; and a heat transfer material 2 sandwiched between a lower surface of a part of the heat dissipation member disposed right above the semiconductor chip 1 and an upper surface of the semiconductor chip 1.
OTANI KATSUMI
KUWABARA KIMIHITO
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
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