To flexibly adapt to design change etc., by improving precision of correction on a temperature measured by a temperature sensor mounted on a semiconductor device.
The semiconductor device (1) generates a correction table (33) holding computed temperature data corresponding to each temperature by computing the temperature data for every temperature using an inverse function of a characteristic correction function generated by correcting a characteristic function, showing ideal correspondence relation between temperature data measured by a temperature sensor portion (31) and temperatures, with a correction coefficient showing an error between the temperatures measured by the temperature sensor portion and actual temperatures. When temperature measurement is performed, the temperature data measured by the temperature sensor portion is retrieved from the correction table, and data (34) of a temperature made to correspond to the retrieved temperature data is output.
YADA NAOKI
ITO TAKAYASU
ARISAKA NAOYA
HIRAKI MITSURU
HORIGUCHI SHINJI
