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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2013065735
Kind Code:
A
Abstract:

To provide a semiconductor device that allows preventing the occurrence of snapback while suppressing degradation of switching characteristics in a configuration in which an IGBT element and a freewheeling diode element are provided together on an identical semiconductor substrate.

In a semiconductor device with a configuration in which an IGBT element and a freewheeling diode element are provided together on an identical semiconductor substrate and a buffer layer is provided between a drift layer of the semiconductor substrate and a collector layer of the IGBT element, the buffer layer is configured by a first buffer layer having a higher impurity concentration than the drift layer and a second buffer layer having a lower impurity concentration than the first buffer layer, and the second buffer layer is in contact with at least a part of the collector layer.


Inventors:
MIYATA MASANORI
TANABE HIROMITSU
Application Number:
JP2011203958A
Publication Date:
April 11, 2013
Filing Date:
September 19, 2011
Export Citation:
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Assignee:
DENSO CORP
International Classes:
H01L27/04; H01L29/06; H01L29/739; H01L29/78
Domestic Patent References:
JPH03105977A1991-05-02
JP2002314082A2002-10-25
JP2012059734A2012-03-22
JP2007288158A2007-11-01
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo



 
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