Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015231027
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which can protect a semiconductor chip by a chip coat material more successfully.SOLUTION: A semiconductor device according to one embodiment comprises a semiconductor chip, a chip mounting substrate where the semiconductor chip is mounted, a chip storage part provided on the chip mounting substrate, for storing the semiconductor chip and an encapsulation part for encapsulating the chip storage part where the semiconductor chip is stored and the chip mounting substrate. The chip storage part has a frame part which surrounds the semiconductor chip and a height of the frame part is higher than a height of the semiconductor chip, and a chip coat material for protecting the semiconductor chip is implanted into the inside of the frame part in the chip storage part.
Inventors:
KOMAI MASAKI
Application Number:
JP2014117862A
Publication Date:
December 21, 2015
Filing Date:
June 06, 2014
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/28; H01L23/29; H01L23/31
Domestic Patent References:
| JPH07211833A | 1995-08-11 | |||
| JPS5833857A | 1983-02-28 | |||
| JP2009289920A | 2009-12-10 | |||
| JPH05175375A | 1993-07-13 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
High Kunio Ki
Kenichiro Wada
Yoshiki Kuroki
High Kunio Ki
Kenichiro Wada
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