Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016045823
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To delay performance deterioration of an element having an increased thermal density due to microfabrication and subject to severe thermal stress, thereby reducing the occurrence of failures.SOLUTION: A detection is made that a temperature of each arithmetic element exceeds a threshold, the excess time is measured and compared, and periods of time in which thermal stresses are applied are compared with each other. The thermal stress is averaged by using the arithmetic element in order from one having the shortest period of time.SELECTED DRAWING: Figure 1
Inventors:
ONISHI MASAJI
Application Number:
JP2014171162A
Publication Date:
April 04, 2016
Filing Date:
August 26, 2014
Export Citation:
Assignee:
CANON KK
International Classes:
G06F9/50; G06F15/78; H01L21/822; H01L27/04
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa