Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016051849
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve a constitution suitable for satisfying both of improved temperature cycle resistance of an electrode pad and reduced material cost of a bonding wire in a semiconductor device in which a plurality of electrode pads provided on a rectangular plate-shaped semiconductor element are connected to connection members via bonding wires, respectively.SOLUTION: A semiconductor device comprises a plurality of electrode pads which are divided into a first pad 21 located on one surface 11 of a semiconductor element 10 on the corner 13 side and a second pad 22 located farther from the corner 13 than the first pad 21. A first wire 51 connected to the fist pad 21 has a Young's modulus smaller than a Young's modulus of a second wire 52 connected to the second pad 22. A thickness d1 of an intermetallic compound layer 71 formed by the first wire 51 and the first pad 21 is thicker than a thickness d2 of an intermetallic compound layer 72 formed by the second wire 52 and the second pad 22.SELECTED DRAWING: Figure 1
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Inventors:
MIYAWAKI SEITARO
HIRANO NAOHIKO
ASAI SHOKI
ASAI YASUTOMI
HIRANO NAOHIKO
ASAI SHOKI
ASAI YASUTOMI
Application Number:
JP2014177044A
Publication Date:
April 11, 2016
Filing Date:
September 01, 2014
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L21/60
Domestic Patent References:
| JP2009088476A | 2009-04-23 | |||
| JP2003264366A | 2003-09-19 | |||
| JP2010199491A | 2010-09-09 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office