Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016062704
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress an increase in the number of solder bonded places.SOLUTION: A semiconductor device capable of data transfer by a USB by being connected with a receptacle comprises: a housing having an opening; a circuit board including a wiring board which is inserted into the opening and has a plurality of connection pads including a first external connection terminal capable of being connected with the receptacle, and a semiconductor chip mounted on the wiring board; a fastening part fastened to an inner wall of the opening; and a second external connection terminal having a fastening part fastened to an inner wall of the opening, and a receptacle connection part which is provided on the same plane with the fastening part and which can be connected with the receptacle, and a first pad connection part and a second pad connection part which are electrically connected to at least one of a plurality of connection pads provided on a surface opposite to the fastening part.SELECTED DRAWING: Figure 1
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Inventors:
SATO HIROTAKA
MUKODA HIDEKO
FUJIMAKI AKIKO
TSUKIYAMA KEISHI
OYAMA KATSUHIKO
KOSAKA YOSHIYUKI
WATANABE AKIO
HARASHIMA SHIRO
ADACHI KOSUKE
MATSUURA EIGO
YAMAGUCHI RYOHEI
DOI MASAYUKI
MUKODA HIDEKO
FUJIMAKI AKIKO
TSUKIYAMA KEISHI
OYAMA KATSUHIKO
KOSAKA YOSHIYUKI
WATANABE AKIO
HARASHIMA SHIRO
ADACHI KOSUKE
MATSUURA EIGO
YAMAGUCHI RYOHEI
DOI MASAYUKI
Application Number:
JP2014188532A
Publication Date:
April 25, 2016
Filing Date:
September 17, 2014
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01R24/60; H01R12/72
Domestic Patent References:
| JP003191030U | ||||
| JP3170687U | 2011-09-29 | |||
| JPH0686271U | 1994-12-13 | |||
| JPH0562733A | 1993-03-12 | |||
| JP2008084570A | 2008-04-10 |
Foreign References:
| US20110188193A1 | 2011-08-04 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
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