Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2016122735
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device at a low cost, which requires no double-structured through electrodes, while preventing configuration from getting large and complicated.SOLUTION: The semiconductor device is formed of plural laminated semiconductor chips 11 to 13 including through electrodes 81 and 82. The semiconductor device includes: spare wiring layers 60 and 70 each of which has a redundant through electrode 83 formed as a spare; and spare wirings 91 and 92 for connecting a defectively bonded through electrode 82 to a redundant through electrode 83 therebetween when a defectively bonded through electrode 82 is generated.SELECTED DRAWING: Figure 4
Inventors:
KAZAMA HIROTAKA
Application Number:
JP2014262124A
Publication Date:
July 07, 2016
Filing Date:
December 25, 2014
Export Citation:
Assignee:
TOSHIBA INFORMATION SYSTEMS (JAPAN) CORP
International Classes:
H01L25/065; H01L21/82; H01L21/822; H01L25/07; H01L25/18; H01L27/04
Domestic Patent References:
| JP2014527731A | 2014-10-16 | |||
| JP2004281633A | 2004-10-07 | |||
| JP2014527731A | 2014-10-16 | |||
| JP2004281633A | 2004-10-07 |
Foreign References:
| WO2007032184A1 | 2007-03-22 | |||
| WO2007032184A1 | 2007-03-22 |
Attorney, Agent or Firm:
Honda Takashi
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