Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018007501
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To equalize an electric current passing through power modules connected in parallel with each other.SOLUTION: A semiconductor device has two power modules connected in parallel with each other. Each of the power modules includes a first terminal, a second terminal and a third terminal projecting from a resin mold, a first switching element which electrically connects and disconnects the first terminal and the third terminal in the resin mold, and a second switching element which electrically connects and disconnects the second terminal and the third terminal in the resin mold. One first terminal, second terminal and third terminal of the two power module are electrically connected to the other first terminal, second terminal and third terminal. Out of the two power modules, a defective portion is provided on at least one of the first terminal of the power module having a smaller on-resistance of the first switching element and the second terminal of the power module having a smaller on-resistance of the second switching element.SELECTED DRAWING: Figure 2
Inventors:
NAKAGAWA MIHIRO
Application Number:
JP2016135041A
Publication Date:
January 11, 2018
Filing Date:
July 07, 2016
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H02M1/00; H01L25/07; H01L25/18; H02M3/155
Domestic Patent References:
| JP2008193867A | 2008-08-21 | |||
| JPS6079291U | 1985-06-01 | |||
| JP2013225590A | 2013-10-31 |
Attorney, Agent or Firm:
Kaiyu International Patent Office
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