Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018207017
Kind Code:
A
Abstract:
To provide a semiconductor device which can ensure high cooling performance within a limited plane of a base where a semiconductor module is mounted, regardless of a flow direction of a coolant in a cooling case.SOLUTION: A semiconductor device comprises a base 3a which further has a plurality of vertex shedders 6 which are arranged to surround each pin fin region 4a; each of the plurality of vertex shedders is formed in a delta cone shape having first through third apexes 6a, 6b, 6c which contact a board surface of the base and a fourth apex 6d which is provided at a distance from the board surface of the base; three angles of the triangle with the first through third apexes are acute angles; the first apex is located opposite to the closest pin fin 5 across a line segment 6f linking the second ape and the third apex; and the fourth ape is located closer to the first apex than the gravity center of the triangle including the first through third apexes.SELECTED DRAWING: Figure 4
Inventors:
HARUBEPPU YU
NISHIHARA ATSUO
TANIE HISAFUMI
SASAKI KOJI
NISHIHARA ATSUO
TANIE HISAFUMI
SASAKI KOJI
Application Number:
JP2017112829A
Publication Date:
December 27, 2018
Filing Date:
June 07, 2017
Export Citation:
Assignee:
HITACHI POWER SEMICONDUCTOR DEVICE LTD
International Classes:
H01L23/473; H05K7/20
Attorney, Agent or Firm:
Kaichi International Patent Office