Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019160833
Kind Code:
A
Abstract:
To provide a semiconductor device capable of appropriately joining pads.SOLUTION: According to one embodiment, a semiconductor device comprises a substrate, a first plug provided above the substrate, a first pad provided on the first plug, a second pad provided on and electrically connected to the first pad, and a second plug provided on the second pad. The semiconductor device further includes an electrode layer electrically connected to the second plug, a charge storage layer provided on a side surface of the electrode layer via first insulation film, and a semiconductor layer provided on a side surface of the charge storage layer via a second insulation film. Furthermore, the first plug and the second plug are arranged so as not to overlap with each other in a first direction perpendicular to a surface of the substrate or they are arranged so that a part of the first plug and a part of the second plug overlap with each other in the first direction.SELECTED DRAWING: Figure 4
Inventors:
TAGAMI MASAYOSHI
Application Number:
JP2018040790A
Publication Date:
September 19, 2019
Filing Date:
March 07, 2018
Export Citation:
Assignee:
TOSHIBA MEMORY CORP
International Classes:
H01L27/11575; H01L21/336; H01L21/768; H01L23/522; H01L27/11573; H01L27/11578; H01L27/11582; H01L29/788; H01L29/792
Domestic Patent References:
| JP2014072418A | 2014-04-21 | |||
| JP2017034156A | 2017-02-09 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi