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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022046919
Kind Code:
A
Abstract:
To provide a semiconductor device with an interlayer dielectric film having excellent insulating properties.SOLUTION: A semiconductor device has a conductive wiring and an interlayer insulating film in which the conductive wiring is embedded, the interlayer insulating film contains a base material containing silicon oxide and hollow particles dispersed in the base material, and the hollow particles are insulators having a three-dimensional network structure.SELECTED DRAWING: Figure 1

Inventors:
NI ZEYUAN
KATO DAIKI
Application Number:
JP2020152561A
Publication Date:
March 24, 2022
Filing Date:
September 11, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B82Y10/00; H01L21/768; B82Y30/00; H01L21/314; H01L21/316
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito