Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022146271
Kind Code:
A
Abstract:
To provide a semiconductor device with a higher performance and a higher quality.SOLUTION: A semiconductor device A1 includes a semiconductor element 1, a die pad 3, a plurality of leads 4, a plurality of connecting members 7, and a resin member 2. The plurality of leads 4 include a first lead 5. The plurality of connecting members 7 include a first connecting member 71. The first lead 5 has a first pad surface 50a and includes a plurality of first portions 51 and a second portion 52. The first pad surface 50a includes a plurality of openings 503 and spans the plurality of first portions 51 and the second portion 52. Each of the plurality of first portion 51 has a back surface 51a. The second portion 52 has a back surface 52a located closer to a side of the first pad surface 50a than the back surface 51a in a thickness direction z. The plurality of first portions 51 include a pair of outer portions 511 located at both ends in a second direction x and an inner portion 512 interposed between the pair of outer portions 511 in the second direction x. The first connecting member 71 is bonded to the first pad surface 50a in the inner portion 512.SELECTED DRAWING: Figure 4
Inventors:
SHIRAI KATSUMUNE
Application Number:
JP2021047150A
Publication Date:
October 05, 2022
Filing Date:
March 22, 2021
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L23/50; H01L21/60
Attorney, Agent or Firm:
Usui Nao